Difference between revisions of "AXIOM Gamma"
| Line 42: | Line 42: | ||
====Pre-Processing Module (PPM)==== | ====Pre-Processing Module (PPM)==== | ||
==Body== | |||
===Core Processing Module (CPM)=== | |||
===2x High Speed I/O Module Slots (HSIOM)=== | |||
Also called High Speed Module | Also called High Speed Module | ||
===Cooling Bay=== | |||
===Low Speed Bridge (LSB)=== | |||
==Stackmodules== | |||
Docking to LSB | Docking to LSB | ||
===Low Speed IO Modules (LSIOM)=== | |||
Last LSIOM in stack | ===Battery Mount=== | ||
Last LSIOM in stack. | |||
==Deliverables== | ==Deliverables== | ||
Revision as of 13:57, 10 August 2015
1 Optical Modules
1.1 Lens Mount Module (LMM)
1.2 Optical Filter Module (OFM)
Optional.
1.3 Image Sensor Module (ISM)
The image sensor in the AXIOM Gamma will be mechanically adjustable in dimensions of flange focal distance (back focus = Z-axis), a shift in XY-axes and XYZ rotation.
For creating space for the heatpipes and decoupling the image sensor from the rest of the module two rigid-flex PCBs are added to the existing designs. The rigid part of the rigid-flex PCB will be screwed to the back of the module exposing the connectors to the back.
Two cooling options:
- passive: Copper heatpipes
- active: Peltier element behind sensor (see below)
Peltier:
Usage of a Peltier-element proves to be problematic:
High power consumption renders mobile usages inefficient
Power consumption within the Peltier generates more additional heat
Water condensation within the electronics on the cool Peltier side, requirement of sealing -> increased complexity of manufacturing, design, maintenance, repairs, etc.
Conclusion:
Sensor front end module without Peltier element for general usage, one version with Peltier element for people who are aware of the implications and/or for experimentation purposes
1.3.1 Sensor Frontend Board (SFB)
1.3.2 Frontend Connector Board (FCB)
1.4 Front Module
1.4.1 Pre-Processing Module (PPM)
2 Body
2.1 Core Processing Module (CPM)
2.2 2x High Speed I/O Module Slots (HSIOM)
Also called High Speed Module
2.3 Cooling Bay
2.4 Low Speed Bridge (LSB)
3 Stackmodules
Docking to LSB
3.1 Low Speed IO Modules (LSIOM)
3.2 Battery Mount
Last LSIOM in stack.
4 Deliverables
Deliverable D1.3 AXIOM Ecosystem Launch Documentation
Deliverable D2.1 AXIOM Gamma ISFE - Hardware Design Documents
Deliverable D2.2 AXIOM Gamma ISFE - Hardware Manufacturing Research/Documentation
Deliverable D2.3 AXIOM Gamma ISFES - Software
This page is work in progress.
5 Mandatory on all publications
This project has received funding from the European Union’s Horizon 2020 research and innovation programme under grant agreement No 645560