Difference between revisions of "May 2022 CP Enclosure"
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Note that existing AXIOM Beta hardware can be integrated into the CP enclosure if a THT sensor board is used. The ZIF sensor board does not fit as it has a bigger form factor with the larger socket and the lever. Also the THT sensor board has an opening underneath the image sensor and we attach a heat sink from the back, this is not possible with the ZIF sensor board. | Note that existing AXIOM Beta hardware can be integrated into the CP enclosure if a THT sensor board is used. The ZIF sensor board does not fit as it has a bigger form factor with the larger socket and the lever. Also the THT sensor board has an opening underneath the image sensor and we attach a heat sink from the back, this is not possible with the ZIF sensor board. | ||
==Early adopter goals== | ==Early adopter goals== | ||
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* testing of internal fan, air circulation, temperature monitoring, fan control in software | * testing of internal fan, air circulation, temperature monitoring, fan control in software | ||
* starting efforts to design print labels on the enclosure (logo, instructions, connectors, etc.) | * starting efforts to design print labels on the enclosure (logo, instructions, connectors, etc.) | ||
==Parts== | ==Parts== | ||
https://cloud.apertus.org/index.php/s/WCE3Z5G5wxQLMYA | https://cloud.apertus.org/index.php/s/WCE3Z5G5wxQLMYA | ||
Revision as of 09:31, 5 May 2022
We started collecting people interested in becoming AXIOM Beta Compact (CP) enclosure early adopters on May 1st. If you are interested please contact us: https://www.apertus.org/contact
The idea is that we optimally gather a group of 10+ people to benefit from the manufacturing prices getting lower with raising quantities.
Once we have a headcount we will be able to deliver an accurate estimate for the cost.
1 Scope
To keep the cost low in general we plan to produce non-structural parts like connector plate covers as 3D print parts, the structural elements from milled aluminium:
Note that existing AXIOM Beta hardware can be integrated into the CP enclosure if a THT sensor board is used. The ZIF sensor board does not fit as it has a bigger form factor with the larger socket and the lever. Also the THT sensor board has an opening underneath the image sensor and we attach a heat sink from the back, this is not possible with the ZIF sensor board.
2 Early adopter goals
- collect general feedback about ergonomics, handling, look & feel
- testing of internal fan, air circulation, temperature monitoring, fan control in software
- starting efforts to design print labels on the enclosure (logo, instructions, connectors, etc.)