Difference between revisions of "AXIOM Gamma"

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====Pre-Processing Module (PPM)====
====Pre-Processing Module (PPM)====


===Body===
==Body==
====Core Processing Module (CPM)====
===Core Processing Module (CPM)===
====2x High Speed I/O Module Slots (HSIOM)====
===2x High Speed I/O Module Slots (HSIOM)===
Also called High Speed Module
Also called High Speed Module
====Cooling Bay====
===Cooling Bay===


====Low Speed Bridge (LSB)====
===Low Speed Bridge (LSB)===


===Stackmodules===
==Stackmodules==
Docking to LSB
Docking to LSB


====Low Speed IO Modules (LSIOM)====
===Low Speed IO Modules (LSIOM)===
====Battery Mount====
 
Last LSIOM in stack
===Battery Mount===
Last LSIOM in stack.


==Deliverables==
==Deliverables==

Revision as of 13:57, 10 August 2015

1 Optical Modules

1.1 Lens Mount Module (LMM)

1.2 Optical Filter Module (OFM)

Optional.

1.3 Image Sensor Module (ISM)

AXIOM-Gamma-Sensor-BoardPeltier.png AXIOM-Gamma-Sensor-Board.png

The image sensor in the AXIOM Gamma will be mechanically adjustable in dimensions of flange focal distance (back focus = Z-axis), a shift in XY-axes and XYZ rotation.

For creating space for the heatpipes and decoupling the image sensor from the rest of the module two rigid-flex PCBs are added to the existing designs. The rigid part of the rigid-flex PCB will be screwed to the back of the module exposing the connectors to the back.


Two cooling options:

  • passive: Copper heatpipes
  • active: Peltier element behind sensor (see below)

Peltier:

Usage of a Peltier-element proves to be problematic:

High power consumption renders mobile usages inefficient

Power consumption within the Peltier generates more additional heat

Water condensation within the electronics on the cool Peltier side, requirement of sealing -> increased complexity of manufacturing, design, maintenance, repairs, etc.

Conclusion:

Sensor front end module without Peltier element for general usage, one version with Peltier element for people who are aware of the implications and/or for experimentation purposes


1.3.1 Sensor Frontend Board (SFB)

1.3.2 Frontend Connector Board (FCB)

1.4 Front Module

1.4.1 Pre-Processing Module (PPM)

2 Body

2.1 Core Processing Module (CPM)

2.2 2x High Speed I/O Module Slots (HSIOM)

Also called High Speed Module

2.3 Cooling Bay

2.4 Low Speed Bridge (LSB)

3 Stackmodules

Docking to LSB

3.1 Low Speed IO Modules (LSIOM)

3.2 Battery Mount

Last LSIOM in stack.

4 Deliverables

Deliverable D1.3 AXIOM Ecosystem Launch Documentation

Deliverable D2.1 AXIOM Gamma ISFE - Hardware Design Documents

Deliverable D2.2 AXIOM Gamma ISFE - Hardware Manufacturing Research/Documentation

Deliverable D2.3 AXIOM Gamma ISFES - Software


This page is work in progress.


5 Mandatory on all publications

EU-emblem.png

This project has received funding from the European Union’s Horizon 2020 research and innovation programme under grant agreement No 645560