AXIOM Gamma

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1 Optical Modules

1.1 Lens Mount Module (LMM)

1.2 Optical Filter Module (OFM)

Optional.

1.3 Image Sensor Module (ISM)

AXIOM-Gamma-Sensor-BoardPeltier.png AXIOM-Gamma-Sensor-Board.png

The image sensor in the AXIOM Gamma will be mechanically adjustable in dimensions of flange focal distance (back focus = Z-axis), a shift in XY-axes and XYZ rotation.

For creating space for the heatpipes and decoupling the image sensor from the rest of the module two rigid-flex PCBs are added to the existing designs. The rigid part of the rigid-flex PCB will be screwed to the back of the module exposing the connectors to the back.


Two cooling options:

  • passive: Copper heatpipes
  • active: Peltier element behind sensor (see below)

Peltier:

Usage of a Peltier-element proves to be problematic:

High power consumption renders mobile usages inefficient

Power consumption within the Peltier generates more additional heat

Water condensation within the electronics on the cool Peltier side, requirement of sealing -> increased complexity of manufacturing, design, maintenance, repairs, etc.

Conclusion:

Sensor front end module without Peltier element for general usage, one version with Peltier element for people who are aware of the implications and/or for experimentation purposes


1.3.1 Sensor Frontend Board (SFB)

1.3.2 Frontend Connector Board (FCB)

2 Front Module

2.1 Pre-Processing Module (PPM)

Sensor access is implemented by using a Xilinx Kintex-7 160T FPGA.

Captures raw image date from the sensor and responsible for general “raw” processing of the sensel (image sensor pixel) values, e.g. spatial and temporal binning of the raw data if lower resolutions and/or frame rates are desired in subsequent processing steps.

3 Body

3.1 Core Processing Module (CPM)

Most likely a Zynq 7030 FPGA + dual ARM core System on Chip (SoC).

3.2 2x High Speed I/O Module Slots (HSIOM)

Also called High Speed Module

Generally used for storage, input or output of high-speed signals. Typical examples would be SSD storage, HDMI/SDI output or SDI input.

For this reason, the HSIOMs have dedicated high-speed access to the preprocessed image data coming from the PPM and the processed Data from the Processing Module.

3.3 Cooling Bay

3.4 Low Speed Bridge (LSB)

4 Stackmodules

Docking to LSB

4.1 Low Speed IO Modules (LSIOM)

4.2 Battery Mount

Last LSIOM in stack.

5 Deliverables

Deliverable D1.3 AXIOM Ecosystem Launch Documentation

Deliverable D2.1 AXIOM Gamma ISFE - Hardware Design Documents

Deliverable D2.2 AXIOM Gamma ISFE - Hardware Manufacturing Research/Documentation

Deliverable D2.3 AXIOM Gamma ISFES - Software


This page is work in progress.


6 Mandatory on all publications

EU-emblem.png

This project has received funding from the European Union’s Horizon 2020 research and innovation programme under grant agreement No 645560