Difference between revisions of "Cooling"

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- new plastics: 10-100 W/mK
- new plastics: 10-100 W/mK
- cast magnesium: 50-100 W/mK
- cast magnesium: 50-100 W/mK
- extrusion grade aluminum: 150 W/mK
- extrusion grade aluminum: 150 W/mK.
New plastics 10x more expensive than normal ones per kg, have thermal expansion closer to those of electronic components than metal, can be conductive (for shielding) or insulating a bit more brittle than normal plastics
New plastics 10x more expensive than normal ones per kg a bit more birttle, have thermal expansion closer to those of electronic components than metal, can be conductive (for shielding) or insulating

Revision as of 10:27, 15 October 2014

Panasonic PGS could be use to transfer the heat from the FPGA to the Camera Body. It can reduce weight and makes the Camera smaller in the ideal case the Apertus doesn’t need a fan. More Information: http://www.panasonic.com/industrial/electronic-components/protection/pyrolytic-graphite-sheet.aspx Video: http://www.youtube.com/watch?v=ZAEhyY1_czM


A hole can be cut in the PCB to allow a metal plate to touch the back of the sensor kac-sensor-socket-board.jpeg (image courtesy of danieel)


Practical experience of cooling down a d450 sensor to sub-zero temperatures with Peltier http://nightskyinfocus.com/diyprojects/canon-450d-dslr-modification


Peltier sensor cooling can be an upgrade pack for Beta


danieel, speaking on KAC-12040 sensor [1]:

uncooled sensor without any thermal management gets to at most 45deg (internal reading).. so you should rather cool/separate the fpga, than care about a sensor (big package with relatively low power)


Sensible advice on thermoelectric cooling: http://www.customthermoelectric.com/TECmounting.html


Heat conductive plastics http://www.ptonline.com/articles/plastics-that-conduct-heat claimed heat conductivity: - new plastics: 10-100 W/mK - cast magnesium: 50-100 W/mK - extrusion grade aluminum: 150 W/mK. New plastics 10x more expensive than normal ones per kg a bit more birttle, have thermal expansion closer to those of electronic components than metal, can be conductive (for shielding) or insulating